Products & Technology

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Extreme Rugged Methodology Comes to Mid-Range ETX

As part of an initiative to extend its Extreme Rugged product lines, Adlink Technology has announced the first new Ampro by Adlink product since the Ampro acquisition was completed. The ETX 620 brings the proven design methodology of the high-end ETX 802 to harsh environments where lower processing performance is required. Based on the AMD Geode LX 800 processor and chipset, the ETX 620 computer-on-module (COM) is designed for mission-critical military, avionics, medical, and industrial applications where failures would have dire consequences or high costs.

ETX 620 features the low-power AMD Geode LX 800 processor and CS5536 companion chip. ETX 620 is designed for extreme rugged environments, able to operate over temperature extremes of -40° to +85°C, vibrations up to 15 Grms and shock up to 50 Grms. With processor speed of 500 MHz and memory support for up to 1 Gbyte of DDR RAM, the ETX 620 fills the price/performance void beneath the ETX 802 module.

ETX 620 offers 2D/3D graphics and offers a choice of TTL or 24-bit LVDS LCD interfaces along with legacy CRT, making it easier for system designers to choose the right display for their solution. ETX 620 also touts a full 16-bit ISA bus due to the use of a PCI-to-ISA bridge with Distributed DMA, rather than an LPC-to-ISA bridge. The use of an Intel Ethernet controller allows wider temperature operation than possible with cheap alternatives.

ETX 620 contains all of the PC-compatible subsystems without the I/O connectors themselves. The I/O and bus signals are passed through high-density surface mount connectors to application-specific carrier boards. ETX 620 I/O includes (2) Serial ATA (SATA) ports, (4) USB 2.0 ports, Intel 10/100 Ethernet, (1) UDMA IDE interface, (2) Serial RS-232 ports, Floppy, Keyboard/Mouse and AC ’97 Audio.

Adlink supports the ETX 620 with a full range of popular embedded Board Support Packages (BSPs) including Windows XP Embedded, Windows CE 5.0 and 6.0, VxWorks 5.5 and 6.4, QNX 6.3, and a complete Linux 2.6 distribution. Prices start in the $200s for the ETX 620 in production quantities.

ADLINK Technology, San Jose, CA. (408) 360-0200. [].

SpaceWire 4-Port Router Targets Aerospace Apps

Originally developed by the European Space Community, SpaceWire is a standard governing serial communication between nodes. The protocol is self-managing and provides a high-speed, low-power serial interface while offering a simple, low-overhead user interface. The standard supports data rates of 2 Mbits/s to 400 Mbits/s over 10 meters of cable. Aeroflex Colorado Springs has developed a SpaceWire 4-Port Router, the UT200SpW4RTR, to satisfy SpaceWire networking and fault-tolerant networking requirements for the aerospace community.

The UT200SpW4RTR 4-port router has a system interface port for 5 total ports, data rates up to 200 Mbits/s on all four SpaceWire ports, and is compliant to Standard ECSS-E50-12A. Power supply core is 2.5V with 3.3V I/O with a host (FIFO) clock frequency of 50 MHz. Radiation performance is targeted at 100 krad(Si); packaging is a 255-lead CLGA. QML Q and V qualification is planned. The UT200SpWRTR is priced at $5,725 in QML Q lots of 100. Prototypes will be available 1Q09 with production units in 2Q09.

Aeroflex Colorado Springs, Colorado Springs, CO.
(719) 594-8035. [].

Multi-Function 3U cPCI Card Adds ARINC 429/575 and More

The multi-function board trend has swept across the embedded system market, and embedded system designers are reaping the benefits. North Atlantic Industries (NAI) has announced an upgrade to the functionality of its single-slot, 2-module, multi-function, 3U cPCI card. This universal card eliminates the complexity and size constraints of using multiple, independent, single-function cards. The 75C2 is ideally suited for military and commercial programs, including airborne, shipboard, ground mobile and C3I applications. Its interchangeable modules increase functional density and reduce power consumption, size and cost of the overall system.

The 75C2 can accommodate up to two independent function modules. ARINC 429/575 (6-channels), RS-422/485/232 (4-channnels), D/S Converter (3-channels) and Reference Generator functions have recently been added to its library of available modules.

Other available function modules include Synchro/Resolver Measurement (4-channels), LVDT Measurement (4-channels), A/D (10-channels), D/A (10-channels), Discrete I/O (16-channels), TTL I/O (16-channels), Transceiver I/O (11-channels) and RTD (6-channels). The interchangeable multi-function design of the 75C2 provides extensive diagnostics and is available in both commercial temperature range and severe environment, industrial temperature range. The 75C2 is available with operating temperature ranges of -40° to +85°C and 0 to +70°C. Conduction-cooled versions with wedgelocks are also available. Pricing for 100 pieces starts at $1,995.

North Atlantic Industries, Bohemia, NY. (631) 567-1100. [].

Compact and Portable Development System Supports 6U Cards

A new system, designed to be a compact and portable system that supports 6U cards for lab and desktop use, is also rugged enough to withstand transporting to and from the field. The 522 Development System from Carlo Gavazzi features a versatile design for hardware and software developers looking for performance and functionality advantages over customary chassis configurations. The 522 Development System provides unobstructed access to both system and rear transition boards for device monitoring.

Addressing the needs of users deploying custom backplanes for specialized applications, the 522 Development System can accommodate VME64, VXS and VPX boards both in 6U and 3U form factors. Modular in design, the 522 system is available in both standard and custom configurations at competitive pricing. It also features high-performance cooling via 200 CFM speed-controlled fans that provide distributed cooling to both the front and rear card modules. The system is available with front-mounted test points and LEDs for all DC voltages, as well as an optional LCD for displaying system voltages and both fan and temperature monitoring functions.

The 522 Development System is available with a 7-slot (CompactPCI, 2 VME64X and 5 VPX) 6U VPX backplane offering high bandwidth in the latest VITA 46 standards with the proven legacy capabilities of VMEbus technology.

Carlo Gavazzi Computing Solutions, Brockton, MA. (800) 926-8722. [].

Free Device Description Explorer for CANopen and Powerlink

A new tool enables the user to inspect and convert CANopen and Powerlink device description files conforming to the CiA 306 and CiA 311, as well as the upcoming EPL V2.0 XML specifications. The Device Description Explorer from IXXAT is available for free download from IXXAT’s Web site.

In 2007 CAN in Automation (CiA), the international users’ and manufacturers’ group governing the development of the CANopen specifications introduced a new XML-based device description file format as CiA 311. CiA 311 is based on the ISO 15745-1:2003 specification, which defines generic elements and rules for describing integration models and application interoperability profiles. A new and more flexible device description format was required due to the numerous enhancements introduced in CANopen that were not covered by the original EDS format as specified in CiA 306. In addition to the general benefits of an XML-based syntax, the CiA 311 format has the particular advantage of allowing for localized device description files, a feature becoming increasingly important with the global acceptance of CANopen.

To facilitate the transition from the previously used EDS file format to CiA 311-compliant files, IXXAT offers the Device Description Explorer as an application that not only converts device description files between the two formats but also allows for a graphical user interface that supports inspection of basic device functionality and the devices’ object dictionary. In version 1.1, the IXXAT Device Description Explorer has been enhanced to support the most recent XML schema definitions as introduced by the CiA task force “XML.”

IXXAT, Bedford, NH. (603) 471-0800. [].

Battery Stack Monitor Supports Hybrid Vehicles & Battery Backup Systems

A highly integrated multi-cell battery monitoring IC is capable of measuring up to 12 individual battery cells. The LTC6802 high-voltage battery stack monitor from Linear Technology allows multiple LTC6802s to be stacked in series without optocouplers or isolators, for precision voltage monitoring of every cell in long strings of series-connected batteries. Long battery strings enable high-power, rechargeable applications, such as electric and hybrid electric vehicles, scooters, motorcycles, golf carts, wheelchairs, boats, forklifts, robotics, portable medical equipment and uninterruptible power supply (UPS) systems.

With superior energy density, Lithium-Ion batteries are poised to be the power source of choice for these applications. However, designing a large, highly reliable and long-lasting Li-Ion battery stack is a very complex problem. Li-Ion cells are sensitive to overcharging or over-discharging, requiring that each cell in a stack is carefully managed. The LTC6802 makes this possible with quick and accurate measurements of all cell voltages, even in the presence of stack voltages over 1000V.

The maximum total measurement error is guaranteed at less than 0.25% from -40° to 85°C, and all cell voltages in a battery stack can be measured within 13 ms. Each cell is monitored for undervoltage and overvoltage conditions, and an associated MOSFET switch is available to discharge overcharged cells. Each LTC6802 communicates via a 1 MHz serial interface, and includes temperature sensor inputs, GPIO lines and a precision voltage reference. 1,000-piece pricing is $9.95 each.

Linear Technology, Milpitas, CA.
(408) 432-1900. [].

Single-Slot, 8-Channel, 3U cPCI I/O Board Extends Functionality in Existing Systems

A new single-slot, 3U CompactPCI I/O board comes with eight 16550D-compatible UARTs. With the physical layers integrated on the board, each channel on the new F216 from Men Micro can be individually configured as single-end RS-232 or as differential RS-422 or RS-485 for added system flexibility. Each channel also has its own 500V isolation to decrease interference between channels.

The F216 provides exceptionally high data transfer rates of up to 921,600 bits/s as well as a 60-byte transmit and receive buffer, making the board useful in systems with large FIFO requirements. The operating temperature of -40° to +85°C (-40° to +185°F) enables the F216’s use in rugged mobile applications including trains and airplanes. Although each port is available on a single front panel 78-pin D-Sub connector, an adapter cable can spread the connector to eight standard 9-pin D-Sub connectors, further increasing system flexibility. Pricing for the F216 is $733 per unit.

MEN Micro, Ambler, PA. (215) 542-9575. [].

ETX 3.0 Computer-on-Module with 45nm Intel Atom N270

A new Computer-on-Module is based on the 1.6 GHz Intel Atom processor N270 that Intel has incorporated into the Embedded Roadmap, thereby ensuring seven years lifecycle support. The ETX-DC Computer-on-Module from Kontron delivers an optimal balance between excellent performance and very low power: With 2.5 watts thermal design power (TDP) for the processor, 6 watts TDP for the Intel 82945GSE Graphics Memory Controller Hub and 1.5 watts TDP for the Intel I/O Controller Hub 7-M (ICH7-M), the ETX-DC requires a maximum TDP of 12-15 watts. Thus, it is the suitable fit for POS and industrial control applications as well as for use in harsh environments that require passive cooling and completely sealed housings. The new module also makes it easier to implement applications with high demands for MTBF and/or EMC. OEMs in the POS, Kiosk, digital signage, infotainment and gaming markets as well as industrial HMI and measurement and control sectors also benefit financially from the best-in-class MIPS per cent ratio.

The new ETX-DC has a 533 MHz FSB and supports up to 2 Gbytes of DDR2-SDRAM SO-DIMM. In terms of interfaces it offers 2 x SATA II in accordance with the AHCI (Advanced Host Controller Interface) standard including Native Command Queuing (NCQ) and staggered spin up as well as hot plugging, USB 2.0 and PCI extension bus along with all the other ETX 3.0 standard interfaces. There is also continued ISA support for older applications. New applications with performance requirements similar to ISA mostly use LPC. The ETX-DC also supports this bus alternative. The optional onboard Trusted Platform Module (TPM 1.2) provides enhanced data security. Integrated graphics offer SDVO and support resolutions up to QXGA (2048 x 1536) via CRT, dual screen via LVDS for resolutions up to UXGA (1600 x 1200) as well as TV-out with HD resolution. There is also onboard HD Audio conforming sound for multimedia support. With the S0/S3(cold&hot)/S4/S5 suspend modes, the ETX-DC Computer-on-Module offers maximum energy savings.

The ETX module integrates all of these features on a footprint of 95 mm x 114 mm. A comprehensive range of software add-ons as well as design guides and sample layouts (supplied with all Kontron Computer-on-Modules) simplify the development of customer-specific carrier boards. The ETX-DC Computer-on-Module is available now and supports Windows Vista, Windows XP, Windows XPe, Windows CE as well as Linux and VxWorks.

Kontron, Poway, CA. (888)-294-4558. [].

2.4 GHz ZigBee Socket Modem Supports Mesh Sensor Networks

In comparison to Wi-Fi networks, wireless mesh networks make considerably greater ranges possible. This means, for example, that monitoring applications can be implemented in large buildings or systems with minimal expenditure. For just these types of applications, the Mod/Zbee1 socket modem from SSV Software Systems uses the 2.4 GHz ISM wireless frequencies based on the IEEE 802.15.4 and ZigBee standards. The Mod/Zbee1 is controlled via a serial interface using AT commands and can be used either as a ZigBee coordinator, router or end point. The module is also available with an integrated chip antenna or a plug for connection to external antennas.

The socket format of the Mod/Zbee1 corresponds to the de facto standard for making OEM devices capable of communication using modules that can be integrated at a later date. Since modules in the socket format are physically compatible, an OEM design can be created regardless of the communication connection. This simplifies and accelerates the engineering and integration of new communication functions into existing and future systems.

Together with the Ethernet modules from the DIL/NetPC family, modular ZigBee to Ethernet gateways can also be constructed. The data of individual ZigBee sensors can be coupled into an IP-based Ethernet LAN directly via a VPN tunnel and, for example, written directly to an SQL database. It is also possible to forward data to the Internet. A starter kit (DNP/9200-RAK1) and an optional on-site installation service are available for evaluation of the Mod/Zbee1 functions.

SSV Software Systems,
Hannover, Germany.
+49 (511) 40 00 042.

Network-Ready Data Acquisition with Preloaded Development Software

A pair of new test, measurement and control products combines a 5-slot PCI backplane and a 10-slot Eurocard cage in an industrial-grade chassis. A Pentium M processor runs server software on a board that occupies one of the PCI slots. This software, and the software running on internal boards themselves, protects the application from local or network-related delays. The new hardware products, the DAPserver 500 and the ruggedized DAPserver 500R models from Microstar Laboratories, each include a SATA hard drive.

DAPserver products conform to the signal-interfacing channel architecture used by Microstar Laboratories: signal connectors on 3U (100 mm high) Eurocard B (220 mm deep) expansion boards that typically pre-process a signal. A DAPserver can contain up to ten of these boards, and it can connect to many more in other rack-mounted industrial enclosures. Most Microstar Laboratories expansion boards multiplex inputs or outputs to or from DAP boards. Many perform additional functions. And every new board now made is intelligent–it communicates with, and can be configured by, the onboard intelligence of the DAP connected to it. These new boards perform any signal conversion required and connect to a digital backplane preinstalled in the 10-slot Eurocard cage in a DAPserver.

A DAPserver has Windows software and the DAPtools Professional software package–including full versions of DAPcell network software and DAPstudio development software–preloaded on the hard drive, running on a Pentium M processor board in one of the PCI slots. The remaining four PCI slots can contain any current DAP boards, and Microstar Laboratories provides hardware and software that combines these DAP boards into a single synchronized system. You can start development right away: use an Ethernet cable to connect a laptop, or connect the DAPserver to a network and use any PC on the network. You also can work directly on the DAPserver: add a screen, and connect a keyboard and mouse to the front-panel USB ports.

Microstar Laboratories, NE, Bellevue, WA. (425) 453-2345. [].

VPX Conduction-Cooled XMC Carrier Offers Options

A new VPX Conduction-Cooled XMC carrier enables accelerated development of rugged conduction-cooled embedded systems. The 3U VPX XMC Carrier from PCI-Systems is a rugged conduction-cooled single-slot 3U VPX XMC Carrier that can connect one XMC module to a standard VPX backplane using PCI Express 1x 8-lane or 2x 4-lane configurations. An XMC module can therefore have two PCI Express chips on board without using an additional switch on the XMC board. PCI-Systems manufactures a variety of COTS modular designed conduction-cooled chassis for VPX, VME, CPCI and CPCI Express applications, including ATR and ARINC 600 enclosures.

Several customized versions for VITA 46 and VITA 48 are available. The carrier has a separate +/- 12V, 150 mA DC-to-DC converter on board. VPX versions are available with a PCI Express bus implementation on the backplane, having 8 lanes per slot and a 64 lane switch, therefore allowing up to 7 add-on slots and a CPU slot for very high bandwidth computing applications.

PCI-Systems, Laurel, MD.
(301) 362-1233. [].

High-Density Serial Communication AMC Module for Extended Temperature

A new synchronous/asynchronous serial AMC module supports four high-speed communication channels. The TAM863 serial communication controller from Tews Technologies is implemented in FPGA logic combined with the bus master-capable PCI interface. It guarantees long-term availability with the option to implement additional application-specific functions for customers. The TAMC863 is designed for data communications, LAN/WAN networking, aerospace/defense communications, traffic control, simulation and telecommunications applications.

Several serial communication protocols are supported by each channel, such as asynchronous, isochronous, synchronous and HDLC mode. In addition, a maximum data rate of 10 Mbits/s is provided for synchronous protocols, and 2 Mbits/s is supported for asynchronous protocols. Multiprotocol transceivers are used for the line interface. The physical interface of each channel can be independently software selected for EIA-232, EIA-422, EIA-449, EIA-530, EIA-530A, V.35, V.36 or X.21. Physical connection is either through front panel I/O with an HD68 SCSI-V (VHDCI/Champ) type connector or rear I/O via P14.

In order to reduce CPU overhead and increase data rates for critical applications, the TAMC863 features a receive and transmit FIFO of 512 long words (32 bit) per channel. Data transfer on the PCI bus is handled via TAMC863-initiated DMA cycles with minimum host/CPU intervention. In addition, several interrupt sources can generate interrupts on INTA for each channel, and interrupts may be enabled or disabled separately. Asynchronous and basic synchronous support for major operating systems such as Windows, Linux, VxWorks and QNX is available.

Tews Technologies, Halstenbek, Germany.
+49 (0) 4101-4058-19. [].

VPX (VITA 46) 6U Buffer Memory Board Supports up to 32 Gbytes

A large capacity 6U VPX buffer memory board supports up to 16 Gbytes of memory on the baseboard along with dual XMC mezzanine sites and Serial RapidIO (sRIO) fabric. The MFC700 6U VPX-REDI (VITA 48) buffer memory node from Vmetro is designed for applications that buffer large amounts of high-speed data and can be utilized in signal and image processing applications, as well as data recording subsystems. Uses of buffer memory include high-speed temporary storage, interleaving, data aggregation and warehousing or the need for additional system memory through a fabric.

The MFC700 supports up to 32 Gbyte DDR2 SDRAM memory in a single slot with 4-16 Gbytes on the MFC700 and 2-8 Gbytes on Vmetro MM-6171 buffer memory node XMC modules. The board supports four x4 high-speed Serial RapidIO links to the VPX P1 connector via an 8-port Serial RapidIO switch and additional I/Os to the backplane. Dual Xilinx Virtex-5 FPGAs serve as the memory controllers for the DDR2 SDRAM with ECC memory. The MFC700 provides additional RocketIO connections between FPGAs and the backplane to give developers flexibility and performance in their data movement. The MPC700 also includes advanced, corner-turning DMA engines which are especially useful in matrix transposition, where converting from columns to rows can eliminate significant processor overhead.

In addition to supporting high-throughput backplane I/O, data may be brought into the MFC700 via onboard XMC sites. With dual XMC sites, the MFC700 enables I/O to be tightly coupled with a large system memory resource. This is useful for what is referred to as rate buffering of high-throughput data (i.e., controlling the rate of flow of data through a system). Incoming data from an XMC can be temporarily stored on the MFC700 and then passed to processing or recording nodes at a rate that does not overrun their capabilities. The MFC700 supports VxWorks and Linux. An API is provided for integration with other boards. The MFC700 is also VPX-REDI compliant with 1” pitch and is available in both air- and conduction-cooled versions.

VMETRO, Houston, TX. (281) 584-0728. [].

PXI Controller Boasts 2.53 GHz Core 2 Duo CPU

Long test cycles can be costly–and with pressure everywhere to reign in costs and development timelines, any test gear that speeds up test time is a welcome investment. With just that in mind, National Instruments rolled out their NI PXI-8108 last month. The PXI embedded controller board features an Intel Core 2 Duo T9400 processor and is designed for high-performance PXI and CompactPCI systems. With its 2.53 GHz dual-core processor and 800 MHz DDR2 memory, the PXI-8108 offers a 25 percent performance improvement over its dual-core predecessor, the NI PXI-8106, and a two times performance improvement over its single-core predecessor, the NI PXI-8196.

With NI LabVIEW 8.6 software, engineers and scientists can take full advantage of the latest multicore controllers, such as the PXI-8108, by simplifying multithreaded application development and achieving increased performance without requiring major changes to existing LabVIEW code. For engineers requiring maximum performance and reliability, the NI PXI-8108 controller can be upgraded to include a 32 Gbyte PXI solid-state hard drive instead of the standard rotating magnetic disk drive. The PXI-8108 paired with the solid-state hard drive offers an extended operating temperature range of 0° to 55°C, increased reliability and speed when reading and writing to files and streaming data, and increased durability when exposed to shock and vibration due to no moving parts. Pricing for the NI PXI-8108 starts at $4,499.

National Instruments, Austin, TX.
(512) 683-0100. [].

COM Express Module with Multicore Options

A new COM Express Module offers OEMs a range of scalable processor options that includes the Intel Core 2 Duo, Core Duo or Single Core Celeron M. System memory supports DDR II 400/533/667 up to 2 Gbytes. Parallel and serial ATA interfaces offer flexibility in storage methods. The MB-73150 from Win Enterprises can be used across a variety of application areas, including, medical, test & measurement, gaming & entertainment, kiosks, military & government and network security. The module is appropriate for applications with multiple functions requiring high performance. OEMs can also use this powerful module to enhance existing system-level designs by increasing their functionality.

In addition to the processor options, the MB-73150 features one DDRII SO-DIMM socket and an Intel 82573L Gbit Ethernet interface. Its integrated graphics support dual SDVO, Analog VGA, LVDS and TV-out interface. The module is PICMG COM Express R1.0 compliant with Flexible PCI Express and PCI expansion and supports COM Express standard features (USB, SATA, ATA, GPIO, AC 97). Linux, Windows Embedded XP and FreeBSD are also supported. OEM quantity pricing is $256 without CPU.

WIN Enterprises, North Andover, MA.
(978) 688-2000. [].

3U VPX XMC Card Delivers Rugged Small Form Factor FPGA Computing

A new 3U VPX (VITA 46/48) compute engine is based on the Xilinx Virtex-5 FPGA and is designed for demanding, high-performance signal and image processing applications including radar, sonar and signal intelligence. The VPX3-450 from Curtiss-Wright Controls Embedded Computing uses the small, compact 3U form factor to make it suitable for space, weight and power (SWaP) constrained applications. With software driver and IP development support from Curtiss-Wright’s Continuum FXtools developer’s kit, the VPX3-450 speeds and simplifies the development of custom FPGA designs.

The VPX3-450 combines the flexibility of a Xilinx Virtex-5 FPGA (LX110T or SX95T) and the general processing power of a Freescale 8640 Power Architecture processor with VPX’s support for high-bandwidth serial switched fabrics such as PCI Express and Serial RapidIO (SRIO). The computing power of the Virtex-5 FPGA is complemented by a balanced mix of memory and I/O. Attached directly to the FPGA is one bank of DDR2 SDRAM and two banks of QDR-II+ SRAM. Two 4-lane high-speed serial ports to the backplane and an additional port to the XMC site provide a total of 7.5 Gbyte/s bandwidth into and out of the FPGA in addition to the primary 4-lane PCI Express link to the onboard fabric.

Software and development tools for the VPX3-450 are part of Curtiss-Wright’s Continuum Software Architecture (CSA), which contains the full Continuum Firmware and BSP package, plus additional VPX3-450 specific support libraries for the 8640 processor using such off-the-shelf operating systems as VxWorks and Linux. The package also provides a set of IP blocks (memory control, serial and LVDS interfaces, etc.), FPGA-specific function libraries (configuration, command bus mappings, etc.) and a scriptable FPGA simulation environment. In addition, the CSA includes the Continuum Vector algorithm library, which provides the card’s onboard Freescale 8640 Power Architecture processor a rich set of optimized signal and image processing functions utilizing the AltiVec unit. The VPX3-450 is designed to operate in rugged environments and is available in air- and conduction-cooled formats. Pricing for the VPX3-450 starts at $12,850. Availability is Q1 2009.

Curtiss-Wright Controls Embedded Computing, Leesburg, VA. (613) 254-5112. [].

Isolated I/O Card with 24 Inputs and Outputs

A 24 output, 24 input isolated I/O card provides 24 isolated 48 VDC 2.5A output drivers. All output drivers are low saturation voltage MOSFETs for low-power dissipation. On the 7I64 from Mesa Electronics, each of the 24 output switches is isolated from the others, allowing high side, low side, push-pull and other output switch configurations. The 24 OPTO-isolated inputs will operate with input voltages from 5 to 24V. Reverse protection diodes are provided to allow use with AC inputs.

A built-in watchdog timer turns all outputs off if the 7I64 is not accessed within the selectable watchdog timeout interval. The 7I64 has three host interface methods: USB, Serial RS-422 and SPI. The 7I64 can be USB powered. The serial interface supports baud rates from 115.2K to 2.5M baud.

The SPI interface is compatible with Mesa’s Anything I/O cards and can be used for high-speed real-time I/O. A SPI breakout card (7I46) allows up to six 7I64s to connect to a single 50-pin Anything I/O connector. The SPI interface supports data rates to 10 Mbits/s so a full read/write of all 48 I/O bits takes approximately 3 uSec. 3.5 mm screw terminal compatible plugs are used for isolated I/O. Price of the 7I64 is $132 in quantity 100.

Mesa Electronics, Richmond, CA.
(510) 223-9272. [].

PCI-104 SSD Storage Adapter Offers RAID Features

Solid-state drives are rapidly usurping more and more rugged embedded applications where once only rotating disk drives had sufficient capacity. The LT-PCI-104-CF from Lauron Technologies is a high-performance PCI-104 32-bit, 33 MHz, 4 channel SSD RAID adapter supporting data rates of up to 120 Mbytes/s. The module adopts the PC/104 stacking architecture, offering embedded designs a compact Solid-State Storage device. This single-slot adapter is available in 2 to 64 Gbyte capacities and is populated with only the fastest, most reliable SLC Compact Flash modules available today. Since the adapter houses all SSD memory, the LT-PCI-104-CF provides the perfect single card solution for non-rotating media requirements.

The unit has an MTBF that is greater than 1,000,000 hours provided by built-in EDC/ECC and Wear Leveling algorithms. The endurance is phenomenal with Erase/Write Cycles greater than 1,000,000, with an extended version that offers 2,000,000 Erase/Write Cycles. The benefit of the built-in flash SSD controller/bridge is that it supports Ultra DMA modes, which yield data transfers at speeds of up to 133 Mbytes/s per channel. The unit supports RAID 0, RAID 1, RAID 0+1, RAID 5 or JBOD. Stripping modes transfers data to all four channels simultaneously while mirror modes transfers data on both channels.

Lauron Technologies, Naples FL.
(239) 431-6237. [].

3U VITA 46 (VPX) FPGA Processing Engine Is FMC/VITA 57 Compliant

A new 3U VPX FPGA processing engine supports the new FPGA mezzanine card (FMC/VITA 57) standard. The FPE320 from Vmetro incorporates the largest available Xilinx Virtex-5 FPGAs and an onboard FMC mezzanine site. This combination of high-performance FPGA processing and the flexibility of FMC-based I/O in an air- or conduction-cooled 3U VPX package, is suitable for demanding real-time applications such as electronic warfare (EW) and signal intelligence (SIGINT), electronic counter measures (ECM) and UAV sensor acquisition.

In 3U systems, physical board size has limited the use of large FPGAs with larger I/O mezzanines such as PMC/XMC. The FMC I/O mezzanine standard enables the use of the largest available Virtex-5 FPGAs in 3U systems because the I/O space requirements are minimized. The FPE320 supports Xilinx Virtex-5 SXT, LXT and FXT FPGAs in the FF1738 package and has a single FMC (VITA 57) mezzanine site for I/O. In addition, the FPE320 provides two banks of DDR2 SDRAM and two banks of QDRII SRAM memory along with four x4 high-speed serial interconnects (16 RocketIO GTPs) to the backplane for PCI Express, Aurora, or Serial RapidIO and additional user-defined I/Os to the backplane.

Development for the FPE320 is supported by Vmetro’s FusionXF FPGA development kit. FusionXF is a collection of software and associated HDL functions to aid customers in the development of their FPGA algorithms and logic for Vmetro’s customer-programmable FPGA products. It is targeted at reducing the design time and optimizing the performance of complex embedded real-time DSP systems comprised of multiple FPGA and PowerPC processors. FusionXF includes a Software Development Kit (SDK) and an HDL Development Kit (HDK). The SDK provides host software support for Windows, VxWorks and Linux. The HDK contains the FPGA interface definitions and HDL functions to build a fully functional FPGA design. Example software and HDL are provided for the interconnects and the external memory with the Virtex-5 FPGA.

VMETRO, Houston, TX. (281) 584-0728. [].

Rugged Fiber-to-USB Converter Does Optical Isolation

USB has opened up a whole new world of performance for embedded PC applications. Blending that with a fiber link sweetens the deal. Electro Standards Laboratories has announced the Model 4165, a ruggedized Fiber-to-USB interface converter. With its integrated rate buffering, the Model 4165 converts USB 2.0-compliant data from a standard PC to a serial asynchronous data interface over fiber with a user-selectable baud rate of up to 3 Mbits/s.

Model 4165 is ideal for PC communications requiring high speed, secure communications and optical isolation. Applications include constructing an optically isolated point-to-point communication link between the USB ports of two PCs, or an optically isolated high-speed communication link between a PC and a serial data network subjected to a high EMI environment that might corrupt the communication over a copper interface. The Model 4165 features ESD protection circuitry on the USB I/O connector. The converter is available as the Model 4166 board only with front-mounting threaded brackets for rack mounting in embedded applications. It is also available in a desktop package with DIN rail mounting hardware for applications that require an enclosure.

Electro Standards Laboratories, Cranston, RI.
(401) 943-1164. [].

Integrated Processor with LCD Controller for Extended-Reliability Applications

An integrated processor combines a high-performance e600 core built on Power Architecture technology, a System-on-Chip (SoC) platform and an LCD controller. The PC8610 from e2v features a single e600 core running at up to 1333 MHz with an extended-temperature range of -40°C to +110°C. With its 256 Kbyte backside L2-cache with ECC, and its AltiVec 128-bit vector processing unit, the PC8610 delivers the level of performance required by computation-intensive tasks such as image processing or display applications. The embedded LCD controller supports real-time display of 24 bits per pixel with a maximum resolution of SXGA (1280 x 1024). The integrated DDR2 memory controller and the two PCI Express ports are providing the bandwidth to feed the processor with data, while the 32-bit PCI2.2 bus supports connectivity to the legacy PCI subsystems.

The PC8610 is manufactured on Freescale’s 90nm process technology and is now available in an extended-temperature range (-40° to +110°C), and e2v also plans to support the military-temperature version (-55° to +125°C) of the product in the first quarter of 2009.

e2v. Saint-Egrève Cedex, France. +33 (0)4 76 58 30 00 [].

AMC Reference Design Kit Based on the PowerPC 460GT

An Advanced Mezzanine Card (AMC) form factor dual-processor reference design kit for the Power Architecture 460GT processor from Applied Microcircuits is a key component in the company’s strategy to support Advanced TCA. The kit, named Arches, provides developers with options for hardware, software, development tools and connectivity interfaces. Arches is an Advanced Mezzanine Card (AMC) industry-standard solution supporting systems based on Serial RapidIO (AMC.4), Gigabit Ethernet (AMC.2) and PCI Express (AMC.1) interconnects.

The new reference design kit provides users with a comprehensive set of resources including: a custom-designed board in the AMC form factor, industry-standard software development tools, open-source middleware for interprocess communications from Enea, a leading RapidIO network management and diagnostic tool from FETCorp, system-level benchmarks, and a complete hardware/software design package.

The Arches card, conforming to the standard single width mid-size AMC form factor (180 mm x 74 mm x 17 mm) includes two AMCC PowerPC 460GT processors, each operating at a clock frequency of 1.0 GHz. Other hardware features include 1 Gbyte of DDR2 SDRAM, 128 Mbytes of NOR flash, 1 Gbyte Micro-SD flash, two serial ports on the front panel, two 10/100/1G Ethernet ports on the front panel, four 10/100/1G Ethernet ports on the AMC connector, x1/x4 Serial RapidIO port on AMC connector, x1/x4 Serial RapidIO/PCI Express port on AMC connector, a shared JTAG connector and two trace connectors. The flash image includes Linux 2.6 kernel and U-Boot boot firmware, along with a file system that incorporates the RapidFET configuration software as well as the open source LINX interprocess communications (IPC) framework developed by Enea, plus a range of AMCC-developed sample applications, benchmarks and utilities. To assist customers in developing their own system software based around the Arches platform, an Embedded Linux Development Kit (ELDK) CD from Denx is included in the kit. The suggested distributor resale price for each kit is $2,995.

Applied Microcircuits Corporation, Sunnyvale, CA.
(408) 542-8600. [].

XMC Card Enables High-Speed Sensor I/O for Embedded Real-Time DSP Systems

The popularity of high-speed serial interconnects in embedded real-time DSP systems, and the effectiveness of FPGAs to interface to sensor I/O, make the mezzanine cards based on them very attractive, demanding, real-time applications such as remote sensor interfaces, data recorders and embedded real-time distributed computing. The XMC-FPGA05F from Vmetro incorporates the Xilinx Virtex-5 FPGA, high-speed fiber-optic transceivers, DDR2 SDRAM memory, DMA controllers and a choice of interfaces.

The XMC-FPGA05F supports the Virtex-5 SX95T and LX155T FPGAs in the FF1136 package. Alternative FPGAs can be provided on request. Fiber-optic links are enabled by four single- or multi-mode, front panel, fiber-optic transceivers that support speeds including 2.015, 2.5 and 3.125 Gbits/s. An IP core for fiber-optic protocols such as Aurora, Serial FPDP, Serial RapidIO or Ethernet can be loaded into the FPGA to handle data flow through the transceivers. The XMC-FPGA05F has four 128 Mbyte banks of DDR2 SDRAM memory with bandwidth approaching 1 Gbyte/s. The PMC/XMC form-factor board supports both PCI-X/PCI and x8 PCI Express 1.1 host interfaces. DMA controllers simplify data movement with enough channels to support a dedicated DMA controller for each fiber-optic interface. The XMC-FPGA05F has onboard flash to store multiple FPGA images and a “flash bypass mode” for secure applications to enable direct FPGA configuration by PCI, PCI-X or PCI Express host interfaces. In addition, there is a 64-bit user I/O option via either the PMC Pn4 or XMC Pn6 ports, which is directly linked to FPGA for high-speed parallel or custom I/O from the backplane or host.

Development for the XMC-FPGA05F is supported by Vmetro’s FusionXF development kit. FusionXF includes a Software Development Kit (SDK) and an HDL Development Kit (HDK). The SDK provides host software support for Windows, VxWorks and Linux, including a driver framework for high-speed DMA access between the XMC and host CPU, FPGA reconfiguration and diagnostics. The HDK contains the FPGA interface definitions and HDL functions to build a fully functional FPGA design. The HDK includes example designs that show how to implement common FPGA functions such as control registers, DMA engines and interrupts, and how to control these functions and communicate with them from software.

VMETRO, Houston, TX. (281) 584-0728. [].

Rugged Conduction-Cooled 3U CompactPCI SBC Board with Enhanced PowerPC

Enhanced PowerPC performance and rugged conduction-cooled construction highlight the new 3U CompactPCI CPU board from Kontron. The CP3210 boasts a fast clock rate of 733 MHz, accelerated DDR SDRAM (266 MHz, + 33.3 %), double the amount of system and user flash and a Gigabit Ethernet port for faster data throughput and overall greater system performance. The CP3210 is an enhanced version of the Kontron PowerEngineC7, a solution already embedded in major defense programs. Additionally, the new Kontron CP3210 incorporates a thermal sensor for health monitoring and thermal management. Just like the PowerEngineC7, the new 3U CompactPCI CPU board is designed to meet the harshest and most demanding requirements through its very low-power dissipation, real-time and certifiable software support as well as rugged conduction-cooled design.

The CP3210 offers an extensive range of standard functions and expansion options including the new powerful PowerPC G3 750FX RISC processor clocked at 733 MHz, onboard user memory of 512 Mbyte DDR SDRAM with ECC clocked at 266 MHz, 128 Mbytes of system flash memory, 256 Mbytes of user flash memory and 128 Kbytes of nvSRAM with realclock. It also offers two onboard serial lines, two Ethernet channels–one Gigabit and one 10/100 as well as one 33/66 MHz PMC expansion slot (PCI Mezzanine Card). To further extend the I/O capabilities, an additional PMC can be implemented via the rugged PMC carrier CPMC1. The Rugged Conduction-Cooled (RC) design enables reliable operation in temperatures ranging from -40° to +85°C according to VITA 47 recommendations. The board is delivered with PowerOn Built-in-Tests and the Open Source U-Boot boot-loader firmware with full CPU source code under GPL. Kontron provides the Real Time Operating Software VxWorks 6.2 Board Support Package, and the Kontron CP3210 offers support for the ElinOS embedded Linux and the DO-178 B and ARINC 653 certifiable PikeOS software provided by Sysgo.

Kontron, Poway, CA. (888)-294-4558. [].

Module Supports All Important Industrial Ethernet Protocols

A new Industrial Ethernet Module enables customers to easily connect their devices to networks based on an Industrial Ethernet standard. The new module from IXXAT was designed from the ground up to support various protocol standards. The use of an Altera Cyclone III FPGA has resulted in low manufacturing costs for the module as well as making it more powerful, lower priced, smaller, and able to be used more flexibly than its predecessor. The Industrial Ethernet Module will be offered for Powerlink, Profinet, EtherNet/IP, EtherCAT and SERCOS III.

The contents of delivery include a protocol-independent host API, which enables the customer to switch between the protocols very easily by making only slight changes to the application. Among other things, IXXAT plans to offer an Ethernet switch, which is integrated into the Module FPGA, by end of this year.

IXXAT supports the module with an evaluation kit, which, in addition to software and documentation, includes a carrier board and an adapter board for the connection of various CPU modules. If the form factor of the Industrial Ethernet Module is not suitable for integration into the customer device, IXXAT offers a design-in solution. Furthermore, IXXAT also offers the development of fully customized solutions on a project basis.

IXXAT, Bedford, NH. (603) 471-0800. [].

micro-ATX Motherboard Features 45nm Core2 Quad Processor Q9400

A micro-ATX form factor motherboard utilizes the new Intel Q45 Express chipset with Intel I/O Controller Hub 10DO. This new embedded board supports the 45nm Intel Core2 Quad processor Q9400 with up to 6 Mbytes of shared L2 cache and up to 1333 MHz Front Side Bus (FSB), delivering high-performance computing in multithreaded and multitasking environments.

The EL330-DR microATX platform from ITOX supports Intel Trusted Execution Technology (Intel TXT) to protect against software-based attacks and safeguard the confidentiality and integrity of data stored or created on an embedded system. In addition, this industrial motherboard features an integrated Intel Graphics Media Accelerator 4500, with the latest graphics technology to enhance multimedia applications. Maximum performance is leveraged with up to 8 Gbytes of DDR3 800 MHz or 1066 MHz memory and two PCI Express Gigabit Ethernet controllers. The EL330-DR also provides 4 Serial ATA ports with speed up to 3 Gbits/s, 1 UltraDMA 100 controller supporting two IDE devices, 8 USB 2.0 ports, 2 Serial COM ports, 1 PCI Express x16 slot, 1 PCI Express x8 slot and 2 PCI slots.

The EL330-DR micro-ATX motherboard is suitable for demanding applied computing and x86 embedded systems applications including voice messaging, medical electronics, industrial control, security & surveillance, telecommunications, ATM/POS, digital signage, gaming and kiosk systems. It also has guaranteed availability for seven years to continually save customers the time and expense associated with additional product testing and verification processes. Pricing starts at $390 with OEM and volume pricing available.

ITOX, East Brunswick, NJ.
(732) 390-2815. [].

Ruggedized Version of IP-Based Wireless Sensor Network for Harsh Environments

An “outdoor-ready” version of an Internet Protocol-based wireless sensor network is geared for use in the growing number of sensing environments where protection from dust, water, corrosion and other harsh conditions is required. PhyNet N4X from Arch Rock gives system integrators the flexibility of battery-powered outdoor nodes connected to a Web-based data platform for developing monitoring solutions in markets such as urban or municipal networks, high-end agricultural products, EPA Superfund and “brown field” development sites and solar power fields.

PhyNet addresses large-scale sensing applications with a three-tier architecture that allows the formation of large, resilient Internet Protocol (IP)-based sensor networks that can be managed centrally as part of the enterprise IP infrastructure. Because PhyNet extends standard IP technology out to the sensor network mesh and even to individual sensor nodes, those nodes can communicate directly with any other IP devices on the enterprise network while being part of well-understood IP-based security schemes. In PhyNet N4X, the PhyNet server sits in a datacenter or other protected location; the sensor nodes, the WSNs that connect them, and the PhyNet Routers that connect the WSNs, reside at the outdoor site to be monitored.

New elements of PhyNet N4X include the NEMA 4X/IP 66 ruggedized enclosures for those parts of the PhyNet architecture potentially exposed to harsh environments: the PhyNet Router and the Arch Rock IPsensor and IPserial Nodes. In addition, the Power Pack is an external battery pack for all outdoor sensor nodes, enabling easier battery replacement in harsh environments, without disturbing the sensitive WSN node electronics. An IPrelay Node is a new node type that has no onboard sensing functions but sits between sensing nodes to extend wireless transmission range utilizing mesh routing. And, also to extend transmission range in outdoor settings, Arch Rock has designed a new higher-gain antenna for the PhyNet Router.

PhyNet products in NEMA 4X/IP 66 enclosures are priced as follows: PhyNet N4X Router $1,995, IPserial N4X Node $395, IPsensor N4X Node $395, IPrelay N4X Node $295, Power Pack N4X $100. A high-gain antenna kit for the PhyNet Router is priced separately at $295. The PhyNet Server is priced at $3,495.

Arch Rock, San Francisco, CA.
(415) 692-0828. [].

PrAMC Features 45nm Core2 Duo SL9380

A next-generation processor AdvancedMC (PrAMC) is based on the latest 45nm Intel Core 2 Duo processor SL9380 running at up to 1.8 GHz, coupled with the Intel 3100 chipset, an integrated memory and I/O controller operating with 800 MHz Front Side Bus. The single-wide PRM-100 PrAMC from JumpGen Systems features dual 10 Gbit/s Ethernet interfaces and dual processor cores to host high-bandwidth embedded communication applications. The PRM-100 is a compact but powerful compute solution optimized to meet customers’ most challenging performance and thermal requirements with high-speed connectivity.

Additional features include up to 8 Gbytes of ECC DDR2 memory running at 400 MHz and up to 8 Gbytes of persistent memory. In addition to dual GigE interfaces (AMC.2 Type E2), it also provides dual 10GigE interfaces (AMC.2 Type 6 or AMC.2 Type 5 with 2nd fabric interface in lanes 17-20 along with dual SATA interfaces (AMC.3). The front panel I/O includes 2 10/100/1000BaseT Ethernet, RS-232 Serial and USB. The PRM-100 is available in both full and mid-size AMC configurations for AdvancedTCA (ATCA), MicroTCA and proprietary architecture systems and it is RoHS compliant.

JumpGen Systems, Carlsbad, CA.
(760) 931-7800. [].

XMC Serves Up Obsolescence-Proof GPU

Subject to the whims of the consumer gaming market, graphics processing technology suffers some of the worst obsolescence problems. Quantum3D announced the availability of its Sentiris AV1, an XMC it claims as the first to offer an obsolescence-proof design. This is accomplished by leveraging a FPGA-based video- and graphics-processing core instead of the traditional approach of using dedicated graphics processing units (GPUs), which are rapidly made obsolete by end-of-life (EOL) announcements.

The Sentiris AV1 XMC was conceived to address the ongoing needs of high safety- and security-critical applications such as primary flight instrumentation and multi-level security (MLS) systems. Certifiable to DO-178B for software and DO-254 for hardware, Sentiris AV1 is the first Sentiris AV1 built using a groundbreaking design approach. The company’s approach is different from traditional GPUs, however, in that it has fully DO-254-certifiable firmware rather than the traditional approach of obtaining a hardware waiver based on a statistical time test. Sentiris AV1 offers 512 Mbytes of ECC-protected DDR2 memory, dual RGB and dual HD-SDI outputs and eight lanes of PCI Express. The product comes standard as a conduction-cooled XMC. The company is currently accepting orders for Sentiris AV1, starting at $9,980.

Quantum3D, San Jose, CA.
(408) 361-9999. [].

8051 Compiler Gets 55% More DMIPS/MHz with 30-50% Smaller Code

What is being called an “omniscient” ANSI C compiler increases DMIPS/MHz and cuts the power drain of Silicon Labs’ 8051-based mixed-signal MCU families, including the ultra-low-power, single-cell C8051F9XX devices. Hi-Tech C Pro for the Silicon Labs 8051 MCU Family reduces interrupt latency, code size and SRAM usage by dynamically optimizing context size and register coverage across all modules of a C-language program. The result is both better code density and fewer instructions cycles required to execute the program. Fewer instruction cycles means the CPU can spend more time in sleep mode, further reducing the already low power consumption of Silicon Labs’ devices.

Using Silicon Labs’ Dhrystone V1.1 benchmark and a 22.11 MHz clock, Hi-Tech’s “omniscient code generation” (OCG) compiler achieves 55% more DMIPS/MHz and 49% smaller code size than any non-OCG compiler. Hi-Tech’s C Pro compiles Silicon Labs’ Ethernet boot loader with 30% smaller code and 20% less SRAM usage. Hi-Tech C Pro utilizes omniscient code generation technology that collects comprehensive data on every register, stack, pointer, object and variable declaration across the entire program. It uses this information to optimize register usage, stack allocations and pointers across the whole program. It also ensures consistent variable and object declarations between modules and deletes unused variables and functions.

Compilers without OCG compile each code module independently, without information from the other parts of the program. Since they do not have information about which registers are used throughout the whole program, they often must save all eight general-purpose registers, as well as other on-chip resources for every interrupt. This process requires as many as 48 clock cycles. In contrast, an OCG compiler has comprehensive information about every variable, register and pointer throughout the entire program. Since it knows exactly which registers will be used for any interrupt, it can determine the context size dynamically, based on the state of the program at the time of compilation. Code generated by an OCG compiler may not need to save any registers during an interrupt routine, thereby saving up to 48 cycles that are wasted by a non-OCG compiler. Hi-Tech C Pro for the Silicon Labs 8051 MCU Family is available now at the introductory price of $1,195 through December 31, 2008, after which it will retail for $1,495.

HI-TECH Software, Gilroy, CA. (800) 735-5715. [].

Solid-State Drives Support SD, MMC and SATA Interfaces in Blade Form Factor

To address the growing market demand for solid-state drives (SSDs), SiliconSystems is developing Secure Digital (SD), MultiMediaCard (MMC) and Serial ATA (SATA) interfaced SiliconDrive II Blade product families in its SiliconDrive II Blade form factor. SiliconDrive II Blade is a flexible advanced solid-state storage solution in a new ultra-small form factor. SiliconDrive II Blade is based upon SiliconSystems next-generation storage platform that offers faster read/write speeds and enhanced performance and reliability to address critical OEM design considerations such as storage system endurance, elimination of drive corruption and the ability to forecast usable life.

SiliconSystems developed its SiliconDrive II Blade product families to provide greater design flexibility to OEMs seeking to use the Universal Serial Bus (USB), SD, MMC or SATA interfaces that were originally developed for consumer desktop and mobile applications, in rigorous OEM applications in the netcom, industrial, embedded computing, data center, military and medical markets. SiliconDrive II USB Blade products are shipping now in capacities up to 4 Gbytes. SiliconDrive II Blade products featuring the SD, MMC and SATA interfaces will be available for volume shipment in the first quarter of 2009.

SiliconSystems, Aliso Viejo, CA.
(949) 900-9400. [].

Voice Media Platforms Target Time-to-Market for Telecom Apps

A family of pre-integrated development platforms for telecommunication network equipment manufacturers provides a robust combination of hardware and software for developing multimedia applications and offers significant time-to-market advantages through the pre-integration of all platform elements. The Voice Media Platforms (VMPs) family from Performance Technologies provides a foundation for new interactive and multimedia applications such as Voice over IP (VoIP), audio conferencing, interactive voice response (IVR), voice and fax messaging, or any application requiring bridging between PSTN and IP networks.

The VMPs are available in a number of preconfigured platforms that include a 4U, 7U, or 12U NEBS-compliant chassis. This scalable approach offers telecom equipment manufacturers a choice of platform and system design configuration options to best meet their requirements, including capacity for up to 13,824 voice ports fully loaded.

The 12U VMP option (VMP121S) comes standard with fourteen pre-integrated Media Blades with T1/E1/J1 network connectivity and voice processing technology for a total of 10,572 G.711 ports. It also includes NexusWare, the company’s Carrier Grade Linux OS and development environment. In addition, it provides two dual-core single board computers, a 2 Tbyte RAID storage blade and redundant Ethernet switches and intelligent shelf managers as well as IPMI-enabled power supplies. Flexible wireless and wireline voice coding support includes G.711, G.726, G.723.1A, G.729A/B, AMR, EVRC and QCELP

Performance Technologies, Rochester, NY.
(585) 256-0200. [].

PCIe Gen2 Switches Support Multicast and Multi-Root Partitioning

A new series of PCI Express (PCIe) system interconnect switches provides higher levels of performance, availability and optimal resource utilization in demanding enterprise applications.

The new PCIe Gen2-compatible switching solutions from Integrated Device Technology provide system architects with new levels of flexibility through a switching architecture that can be partitioned, and that enables dynamic assignment of PCIe slot and I/O peripherals for on-the-fly resource sharing and load balancing among multiple root complexes. The architecture also provides increased system availability and reliability options with advanced failover support. Moreover, the architecture allows developers to achieve improved power efficiency by reducing power consumption and board space requirements with a single IDT device replacing multiple discrete switches.

A key new feature of the IDT switches is that they support multicast. This key construct, which allows any switch port to simultaneously send identical data to two or more switch ports, increases system resource utilization by decreasing the previously required hardware and software overhead needed to send copies of data in a looped manner. This goes beyond the PCIe standard and ensures consistency in data and table information among multiple host processors, and extends the reach of PCIe into emerging enterprise computing and communications applications requiring robust data coherency and sharing.

IDT is announcing five new devices with system interconnect solutions targeting data and services plane traffic as well as control plane traffic. Solutions for high-performance data traffic include the industry’s largest PCIe switch, a 64-lane and 16-port device, a 48-lane, 12-port device and a 32-lane, 8-port device. Devices for control plane traffic include a 34-lane, 16-port device and a 22-lane, 16-port device. All of the new devices are PCIe specification 2.0 compliant (Gen2) and are based on a robust system interconnect switch architecture that is optimized to meet the capacity, scalability and predictable throughput requirements demanded by systems for consistent high performance and flexible system resource sharing. As with other established IDT solutions, the new devices have been optimized for low power and offer industry-leading performance-per-watt, enabling scalable and increasingly dense system architectures and reducing the total cost of ownership by significantly minimizing thermal management requirements.

All of the new switches have a dedicated evaluation and development kit for device testing, analysis and system emulation. Each kit consists of a hardware development board with representative upstream and downstream connectivity, and an IDT-developed, GUI-based software environment that enables the designer to tune system and device configurations to meet system requirements.

Integrated Device Technology, San Jose, CA.
(408) 284-8200. [].

3619-3711 MHz VCO Targets Comm Apps